1/10 may 2003 . std30pf03l p-channel 30v - 0.025 w - 24a ipak/dpak stripfet? ii power mosfet n typical r ds (on) = 0.025 w n standard outline for easy automated surface mount assembly n low treshold device n low gate charge n through-hole ipak (to-251) power package in tube (suffix -1") n surface-mounting dpak (to-252) power package in tape & reel (suffix t4") description this mosfet is the latest development of stmicroelectronics unique single feature size? strip- based process the resulting transistor shows extremely high packing density for low on-resistance and low gate charge. applications n dc-dc converters type v dss r ds(on) i d std30pf03l 30 v <0.028 w 24 3 2 1 1 3 ipak to-251 (suffix -1) dpak to-252 (suffix t4) ordering information absolute maximum ratings ( ) pulse width limited by safe operating area. (#) current limited by wire bonding (1) starting t j = 25 o c, i d =12 a, v dd = 15v note: for the p-channel mosfet actual polarity of voltages and current has to be reversed sales type marking package packaging STD30PF03LT4 std30pf03l-1 d30pf30l d30pf30l to-252 to-251 tape & reel tube symbol parameter value unit v ds drain-source voltage (v gs = 0) 30 v v dgr drain-gate voltage (r gs = 20 k w ) 30 v v gs gate- source voltage 16 v i d(#) drain current (continuous) at t c = 25c 24 a i d(#) drain current (continuous) at t c = 100c 24 a i dm ( ) drain current (pulsed) 96 a p tot total dissipation at t c = 25c 70 w derating factor 0.47 w/c e as(1) single pulse avalanche energy 850 mj t stg storage temperature -55 to 175 c t j operating junction temperature internal schematic diagram
std30pf03l 2/10 thermal data (*) when mounted on 1 inch 2 fr-4 board, 2 oz of cu electrical characteristics (t case = 25 c unless otherwise specified) off on (* ) dynamic rthj-case rthj-amb rthj-pcb t l thermal resistance junction-case thermal resistance junction-ambient (*) thermal resistance junction-pcb maximum lead temperature for soldering purpose max max max 2.14 100 50 275 c/w c/w c/w c symbol parameter test conditions min. typ. max. unit v (br)dss drain-source breakdown voltage i d = 250 a, v gs = 0 30 v i dss zero gate voltage drain current (v gs = 0) v ds = max rating v ds = max rating t c = 100c 1 10 a a i gss gate-body leakage current (v ds = 0) v gs = 16 v 100 na symbol parameter test conditions min. typ. max. unit v gs(th) gate threshold voltage v ds = v gs i d = 250 a 1v r ds(on) static drain-source on resistance v gs = 10 v i d = 12 a v gs = 5 v i d = 12 a 0.025 0.032 0.028 0.040 w w symbol parameter test conditions min. typ. max. unit g fs (*) forward transconductance v ds = 15 v i d = 12 a 23 s c iss c oss c rss input capacitance output capacitance reverse transfer capacitance v ds = 25v, f = 1 mhz, v gs = 0 1670 345 120 pf pf pf
3/10 std30pf03l switching on switching off source drain diode (*) pulsed: pulse duration = 300 s, duty cycle 1.5 %. ( ) pulse width limited by safe operating area. symbol parameter test conditions min. typ. max. unit t d(on) t r turn-on delay time rise time v dd = 25 v i d = 24 a r g = 4.7 w v gs = 5 v (resistive load, figure 3) 64 122 ns ns q g q gs q gd total gate charge gate-source charge gate-drain charge v dd = 15v i d = 24a v gs = 5v 21 5.5 11 28 nc nc nc symbol parameter test conditions min. typ. max. unit t d(off) t f turn-off delay time fall time v dd = 25 v i d = 24 a r g = 4.7 w, v gs = 5 v (resistive load, figure 3) 36 26 ns ns symbol parameter test conditions min. typ. max. unit i sd i sdm ( ) source-drain current source-drain current (pulsed) 24 96 a a v sd (*) forward on voltage i sd = 12 a v gs = 0 1.3 v t rr q rr i rrm reverse recovery time reverse recovery charge reverse recovery current i sd = 24 a di/dt = 100a/s v dd = 24 v t j = 150c (see test circuit, figure 5) 40 52 2.6 ns nc a electrical characteristics (continued) safe operating area thermal impedance
std30pf03l 4/10 output characteristics transfer characteristics transconductance static drain-source on resistance gate charge vs gate-source voltage capacitance variations
5/10 std30pf03l normalized gate threshold voltage vs temperature normalized on resistance vs temperature source-drain diode forward characteristics normalized breakdown voltage vs temperature . .
std30pf03l 6/10 fig. 1: unclamped inductive load test circuit fig. 1: unclamped inductive load test circuit fig. 2: unclamped inductive waveform fig. 3: switching times test circuits for resistive load fig. 4: gate charge test circuit fig. 5: test circuit for inductive load switching and diode recovery times
7/10 std30pf03l dim. mm inch min. typ. max. min. typ. max. a 2.2 2.4 0.086 0.094 a1 0.9 1.1 0.035 0.043 a3 0.7 1.3 0.027 0.051 b 0.64 0.9 0.025 0.031 b2 5.2 5.4 0.204 0.212 b3 0.85 0.033 b5 0.3 0.012 b6 0.95 0.037 c 0.45 0.6 0.017 0.023 c2 0.48 0.6 0.019 0.023 d 6 6.2 0.236 0.244 e 6.4 6.6 0.252 0.260 g 4.4 4.6 0.173 0.181 h 15.9 16.3 0.626 0.641 l 9 9.4 0.354 0.370 l1 0.8 1.2 0.031 0.047 l2 0.8 1 0.031 0.039 a c2 c a3 h a1 d l l2 l1 1 3 = = b3 b b6 b2 e g = = = = b5 2 to-251 (ipak) mechanical data 0068771-e
std30pf03l 8/10 dim. mm inch min. typ. max. min. typ. max. a 2.2 2.4 0.086 0.094 a1 0.9 1.1 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.9 0.025 0.035 b2 5.2 5.4 0.204 0.212 c 0.45 0.6 0.017 0.023 c2 0.48 0.6 0.019 0.023 d 6 6.2 0.236 0.244 e 6.4 6.6 0.252 0.260 g 4.4 4.6 0.173 0.181 h 9.35 10.1 0.368 0.397 l2 0.8 0.031 l4 0.6 1 0.023 0.039 == d l2 l4 1 3 == b e == b2 g 2 a c2 c h a1 detail "a" a2 detail "a" to-252 (dpak) mechanical data 0068772-b
9/10 std30pf03l *on sales type
std30pf03l 10/10 information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publicati on are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics prod ucts are not authorized for use as critical components in life support devices or systems without express written approval of stmicroelectro nics. the st logo is registered trademark of stmicroelectronics a 2003 stmicroelectronics - all rights reserved all other names are the property of their respective owners. stmicroelectronics group of companies australia - brazil - canada - china - finland - france - germany - hong kong - india - israel - italy - japan - malaysia - malt a - morocco - singapore - spain - sweden - switzerland - united kingdom - united states. http://www.st.com
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